Bonding examination equipment: large C-Scan
Unique metallization wetting process for material bonding which is an optimized method for large size sputtering target. We have uniform heating plate, flatness equipment, ultrasonic tester and transportation equipment to meet vary TFT-LCD generations.
Services
- Target bonding for metal, oxide-based and brittle materials.
Main Products
Display/Touch Thin Film Targets, Optical Data Storage Media Targets, High Frequency/Passive Component Thin Film Target Materials, Tool/Coating Thin Film Targets, Semiconductor Targets and Evaporation Materials, Sputtering Equipment Components, Aluminum-Based Composite Materials, Pure Titanium and Ti
Contact Detail
-
AddressNo.1, Luke 8th Rd., Lujhu District, Kaohsiung, Taiwan R.O.C.
-
Tel+886-7-6955125
-
Fax+886-7-6955205
-
E-mail
-
URL