Mapsuka Industries Co., Ltd.
OCP NIC 3.0 Bracket / Mounting Kit — Specification
• Material: Cold-rolled steel (CRS) with nickel plated
• Thickness: 0.8 mm – 1.2 mm
• Form Factor: Available in SFF (Small Form Factor) and LFF (Large Form Factor) dimensions
• Mounting Options: Supports thumbscrew or latch fastening
• Compliance:
o EMI shielding requirements
o Thermal dissipation considerations
o RoHS Directive compliance
• Material: Cold-rolled steel (CRS) with nickel plated
• Thickness: 0.8 mm – 1.2 mm
• Form Factor: Available in SFF (Small Form Factor) and LFF (Large Form Factor) dimensions
• Mounting Options: Supports thumbscrew or latch fastening
• Compliance:
o EMI shielding requirements
o Thermal dissipation considerations
o RoHS Directive compliance
| PICMG | CompactPCI |
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Main Products
CompactPCI chassis, VME Ejector handles, Front panels, PCB holders, EMC gaskets, Card Accessories, Fan units, Subracks, Backplanes, PMC bezels, Insulating Strips, Blades, cPCI power supply
Contact Detail
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Sales ContactSales Manager Erin Kao
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AddressNo.23 Ching Shyang St., Tu Cheng District, New Taipei City, Taiwan
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Tel886-2-22690567
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Fax886-2-22690327
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E-mail
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URL