SMT EMI Shielding Fingers & Grounding Contact Springs

Designed to replace traditional metal fingers and bulky EMI gaskets, Alink’s SMT contact fingers offer an ultra-compact footprint engineered for modern thin and lightweight electronics. By seamlessly integrating with automated SMT assembly processes, our solutions significantly increase production throughput and cost efficiency.

Dual-Layer Electroplating Technology for Harsh Environments

To ensure optimal performance under challenging operating conditions, Alink’s SMT shielding fingers feature specialized multi-layer electroplating:

• Outer Gold (Au) Plating: Delivers superior electrical conductivity and exceptional environmental resistance. (Tin plating options available upon customer request).



• Inner Nickel (Ni) Plating: Provides outstanding adhesion, high friction tolerance, and robust protection against internal oxidation and high humidity.

Flexible Design for Next-Gen Devices

With highly customizable dimensions, Alink SMT shielding fingers offer engineers maximum design flexibility for grounding, mechanical retention, and EMI/RFI shielding across compact mobile devices, smartphones, laptops, wearables, and 5G/IoT equipment.